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2024年北京٠埃森焊接与切割展览会产品与服务 HiFocus

HiFocus

参展商
Kjellberg Cutting Kunshan Co. Ltd.

等离子切割系统满足 0.5 至 160 mm 切割范围的最高要求。由于等离子弧通过大量旋转的涡流气体收缩，因此可以在几乎无渣和矩形切割表面实现精确切割。用户受益于各种可能的应用以及由于高切割和打标速度而降低的工艺成本。

HiFocus series: perfect plasma cutting quality for highest demands up to 160 mm

HiFocus series: perfect plasma cutting quality for highest demands up to 160 mm

HiFocus: high precision plasma cutting

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